Reduced cycle process for the manufacture of printed circuits, and a composition for carrying out said process
US5104687A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 1990 |
| Grant date | Apr 14, 1992 |
| Priority date | — |
| Expiry date | Jun 21, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/122
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing printed circuits provided with through holes, which comprises a cleaning pretreatment including a possible treatment by an organic solvent, a treatment in an alcaline solution of permanganate and a treatment for permanganate reduction, and a subsequent metallization treatment including a treatment for conditioning the walls of the through holes, a treatment for mordanting the copper surfaces, a precatalysis treatment, a catalysis treatment and a metallization treatment by a chemical copper both, wherein three treatments, namely reducing the permanganate, conditioning the walls of the through holes and mordanting the copper surfaces, are performed in a single step. The treatment for conditioning the walls of the through holes is performed by means of non-surfactant, water soluble polymers belonging to the group of the cationic polyelectrolytes. The composition for carrying out three treatments in a single step comprises an acid, hydrogen peroxide, a stabilizer for the hydrogen peroxide and a non-surfactant conditioner belonging to the group of the cationic polyelectrolytes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.