Method and apparatus for automated solder deposition at multiple sites
US5104689A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1990 |
| Grant date | Apr 14, 1992 |
| Priority date | — |
| Expiry date | Sep 24, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The method and apparatus of the present invention permits the automated deposition of heated solder onto a plurality of conductive pads which are disposed in one or more linear arrays on a circuit board or other planar member. A robotically controlled arm is utilized to mount a solder nozzle and selectively manipulate the solder nozzle over the circuit board. The solder nozzle is first manipulated to a selected point offset in a known direction and distance from a first conductive pad by means of a data set which specifies the centroid and footprint for a selected group of conductive pads. After feeding solder into the solder nozzle, aligning the solder nozzle at a desired angle parallel to a linear array of conductive pads and lowering the solder nozzle until a solder droplet contacts the circuit board, the solder nozzle is manipulated at a substantially constant velocity toward the first conductive pad and thereafter along a selected line which tracks the linear array of conductive pads. To avoid solder starvation at the last few pads in a linear array, the solder nozzle is manipulated at a selected angle away from the selected line while decreasing the solder nozzle velocity. Th…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.