Curable silicone composition
US5104919A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 1990 |
| Grant date | Apr 14, 1992 |
| Priority date | — |
| Expiry date | Mar 15, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/70
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable silicon composition comprising: PA1 (A) an organopolysiloxane containing at least two silicon-bonded unsaturated aliphatic hydrocarbon groups and having a viscosity of from 100 to 200,000 cSt at 25.degree. C., PA1 (B) a vinyl group-containing organocyclopolysiloxane having the general formula (I): ##STR1## wherein R represents a hydrocarbon group having from 1 to 6 carbon atoms excluding unsaturated aliphatic hydrocarbon groups, and n represents an integer of from 3 to 8, PA1 (C) an organohydrogenpolysiloxane containing at least two silicon-bonded hydrogen atoms in the molecule, PA1 (D) a platinum family metal catalyst, and PA1 (E) a triazole compound. This curable silicone composition has good curing properties and can produce cured products having a markedly small permanent compression set.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.