Patent · US Expired

Reactive polyimides for addition to thermosetting resins, and process for preparation of same

US5104970A · kind A · utility

1Cited by
5References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 20, 1990
Grant dateApr 14, 1992
Priority date
Expiry dateDec 20, 2010

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L63/00
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Thermoplastics containing imide groups in the polymer backbone, soluble in an unmodified state, are rendered reactive with thermosetting resins by partial conversion of the polymer backbone to provide reactive groups. The modified polymer may be added as microspheres to a thermosetting resin, subsequently crosslinking therewith supressing solvent sensitivity in a fiber reinforced matrix composite comprising the toughened resin as the matrix therefore. The modified polymer microspheres retain their physical identity in the cured composite structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.