Coplanar waveguide directional coupler and flip-clip microwave monolithic integrated circuit assembly incorporating the coupler
US5105171A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 1991 |
| Grant date | Apr 14, 1992 |
| Priority date | — |
| Expiry date | Apr 29, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/186
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A coplanar waveguide directional coupler (116,134) may be formed on a surface (102a,106a) of a substrate (102) and/or a microwave monolithic integrated circuit (MMIC) chip (106), with the MMIC chip (106) being flip-chip mounted on the substrate (102). The directional coupler (116,134) includes an input port (114,136), a coupled port (126,154), a direct port (122,152) and an isolation port (1118,150) formed on the surface (102a,106a). At least two parallel first striplines (24,26) are formed on the surface (102a,106a), having first ends connected to the input port (114,136) and second ends connected to the direct port (122,152). At least two parallel second striplines (36,38) are formed on the surface (102a,106a), having first ends connected to the coupled port (126,154) and second ends connected to the isolation port (118,150). The second striplines (36,38) are interdigitated with the first striplines (24,26) to provide tight signal coupling therebetween. First and second main ground planes (52,54) are formed on the surface (102a,106a) and extend parallel to and on opposite respective sides of the interdigitated first and second striplines (24,26,36,38). The input port (114,136), c…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.