Metal system for semiconductor die attach
US5105258A · kind A · utility
13Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 1990 |
| Grant date | Apr 14, 1992 |
| Priority date | — |
| Expiry date | Nov 21, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A layer of aluminum is formed on a surface of a thermal expansion buffer which is used in a semiconductor package. A semiconductor die is attached to the aluminum using a die attach material. An electrical connection for the die is created by attaching a wire from the semiconductor die to the aluminum surface of the buffer. This provides a reliable semiconductor package useful in a high temperature environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.