Patent · US Expired

Monitoring compaction of backfill

US5105650A · kind A · utility

8Cited by
21References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 8, 1990
Grant dateApr 21, 1992
Priority date
Expiry dateMar 8, 2010

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01N2291/0232
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

Methods and apparatus for monitoring the compaction of backfill material in an excavation include hammer structure for impacting backfill material in the excavation, a sensor module for disposition at the bottom of the excavation to be backfilled that includes a transducer for developing an electric signal in response to energy transmitted through backfill material from the hammer structure, and a control module responsive to electric signals from the sensor module for providing an indication of the quality of compaction of backfill material in the excavation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.