Laser diode array mounting module
US5107091A · kind A · utility
11Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 1990 |
| Grant date | Apr 21, 1992 |
| Priority date | — |
| Expiry date | Sep 14, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02325
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A mounting module for a laser diode array has a microchannel heat sink assembly and a circulation means for flowing a cooling fluid to and from the microchannel heat sink so as to dissipate heat. The microchannel heat sink has a plurality of internal microchannels, and has an external planar surface to affix laser diode submounts which facilitate attachment of laser emitting bars. The circulation mans comprises a housing having canals which circulate the cooling fluid. The housing has an external surface to which an electrical distribution means is placed, the distribution means providing electrical power to the laser diode array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.