Acceleration pick-up
US5107708A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 3, 1990 |
| Grant date | Apr 28, 1992 |
| Priority date | — |
| Expiry date | Jan 3, 2010 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P15/123
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In an acceleration pick-up (11), the bending spring (13) is a substrate plate, e.g. produced from Al.sub.2 O.sub.3, which is arranged at one side on an elevated portion (12) of a support (10) produced from mechanically rigid material. Accordingly, the resistors (19 to 22) and particularly the evaluating circuit (24) on an elevated portion (12) of the support (10) can be arranged jointly on the bending spring (13) and applied in a single work step using thick-film technology. In addition, a cut out portion (14) is formed in the bending spring (13), so that two bending webs (15, 16) can be formed at the greatest possible distance from one another. Two of the resistors (19, 21) are arranged on the bending webs (15, 16) and one of the remaining resistors (20, 22) is arranged in the area of the cut out portion (14). Accordingly, an electrical monitoring of the mechanical state of the bending spring (13) is made possible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.