Device for forming electric circuits on a lead frame
US5108023A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 1990 |
| Grant date | Apr 28, 1992 |
| Priority date | — |
| Expiry date | Oct 26, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S269/903
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a device for forming electric circuits on a lead frame, which has a plurality of process points in a row, each of which is provided with a semiconductor chip. During bonding, for achieving an optimum ultrasonic power transfer necessary for the electric connection of the semiconductor chip (8) to the connection fingers (5) of the lead frame, the individual lead frame (1) is located between a heated bearing element (19) and a correspondingly constructed holding plate (40). In the case of the device (50) according to the invention, the holding plate (40) provided for a contacting member (transducer) with a correspondingly constructed window-like recess (45) is movably mounted relative to the bearing element (19) about at least one axis (S) oriented in the longitudinal direction of the holding plate (40) on two spaced studs (35, 35'), each of which is arranged on a spring element (34, 34'). The axis (S) passes through the center of the recess (45) and interconnects the two studs (35, 35' ).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.