Method of inspecting solder joints
US5108024A · kind A · utility
36Cited by
1References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 1991 |
| Grant date | Apr 28, 1992 |
| Priority date | — |
| Expiry date | Jun 3, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49004
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A solder joint inspection system comprises a substrate (60) having at least one solder pad (56), a predetermined amount of solder (54) on the solder pad, and an image fluxing material (52) that fluoresces when an ultraviolet light source (42) is applied to the solder (54) and the fluxing material (52). When an ultraviolet light source is applied to the substrate having a predetermined amount of solder and fluxing material, a visual inspecting device (40) can verify if, in fact, the predetermined amount of solder and fluxing material is present.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.