Flip chip solder bond structure for devices with gold based metallization
US5108027A · kind A · utility
48Cited by
6References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 1991 |
| Grant date | Apr 28, 1992 |
| Priority date | — |
| Expiry date | Apr 12, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip-chip solder bonding arrangement including a semiconductor substrate having thereon layers of metallization which have a tendency to interact with a solder material, forming on said layers of metallization a barrier metallization layer which is not reactive with said solder material, forming solder pads on the barrier layer and thereafter forming solder bonds with such solder pads employing said solder material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.