Method of surface treatment
US5108543A · kind A · utility
23Cited by
16References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 1988 |
| Grant date | Apr 28, 1992 |
| Priority date | — |
| Expiry date | Oct 20, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32137
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Surface treatment is applied to a substrate by supplying thereto excited molecules in which the vibrational energy level is excited. SF.sub.6, O.sub.2, N.sub.2, etc., are used as the excited molecules and supplied to the substrate as beams. This method is particularly suitable for the surface treatment in the production of semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.