G-tab manufacturing process and the product produced thereby
US5108553A · kind A · utility
187Cited by
16References
49Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 1989 |
| Grant date | Apr 28, 1992 |
| Priority date | — |
| Expiry date | Sep 25, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thin, preferably flexible circuit having multiple conductive planes separated by a non-conductive layer is provided. Conductive vias electrically interconnect the conductive planes. The conductive vias comprise carbon coated blind vias which are made conductive by the electrolytic deposition of a metal on the carbon. The invention is particularly suited for G-TAB wherein a first metal plane is patterned into signal plane circuit traces and a second metal plane is patterned into ground plane traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.