Thermoplastic resin characterized by an improved heat resistance
US5109065A · kind A · utility
9Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 1989 |
| Grant date | Apr 28, 1992 |
| Priority date | — |
| Expiry date | Aug 10, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/905
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An improved thermoplastic composition is described, comprising polyphenylene ether resin, polyamide resin, a saturated aliphatic polycarboxylic acid, and a modified polyolefin such as an ethyleneethyl acrylate-g-maleimide copolymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.