Method of designing three dimensional electrical circuits
US5109479A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 7, 1989 |
| Grant date | Apr 28, 1992 |
| Priority date | — |
| Expiry date | Sep 7, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/056
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A computer aided design package is used to create a mathematical representation of a three-dimensional object. This object is defined as a set of surfaces oriented in space. A map of the flattened object is created by concatenating selected ones of the surfaces on a single plane. The outline of this map is then used in a computer aided circuit layout package as a printed circuit board on which an electrical circuit is placed and routed. The circuit is translated into a three dimensional form corresponding to the surface of the object by translating and rotating the representation of the object to align each selected surface with the circuit description generated by the circuit layout package. The portion of the circuit corresponding to the surface is then transferred to a three-dimensional data structure having a format that is compatible with numerically controlled machining apparatus. This data structure is used to drive a numerically controlled machine tool that cuts a phototool. This phototool is a three-dimensional mask that may be used to print the circuit on the surface of the three-dimensional object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.