Solderless interconnect
US5110298A · kind A · utility
34Cited by
8References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 1991 |
| Grant date | May 5, 1992 |
| Priority date | — |
| Expiry date | Sep 12, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/209
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integral electrical interconnection is made between two circuit carrying substrates (100 and 110). The first circuit carrying substrate (100) contains one or more protrusions (102) on the peripheral edge of the substrate (100) which couples to a series of one or more apertures (104) on the peripheral edge of a second circuit carrying substrate (110). Both the tabs and the apertures are covered with conductive materials (202 and 210) also connected to the circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.