Patent · US Expired

Process for making electrically conductive patterns

US5110384A · kind A · utility

21Cited by

1References

9Claims

0Family size

Assignee

E.I. DU PONT DE NEMOURS AND COMPANY · US

Inventors

Dietmar Dudek · Langen, DE
Thomas Pfeiffer · Kumhausen, DE

Key dates

Filing date	Apr 17, 1990
Grant date	May 5, 1992
Priority date	—
Expiry date	Apr 17, 2010

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1131
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A process for making an electrically conductive pattern on a substrate including forming a patterned adhesive layer on the substrate, applying a conductive metal powder to the adhesive layer, and in a second coating pass, applying a powder containing supplementary elements to the pattern. The patterned substrate is fired to volatilize theadhesive layer and sinter the powders. This process can be used to make printed circuits on ceramic substrates which are useful in hybrid circuits, for example.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.