Primer composition containing an organometallic compound for binding substrates with a cyanocrylate adhesive
US5110392A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 1990 |
| Grant date | May 5, 1992 |
| Priority date | — |
| Expiry date | May 3, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J5/124
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A process for bonding a polyolefin, polyfluoroolefin, polyethylene terephthalate, polyacetal, nylon or plasticizer-rich soft polyvinyl chloride substrate to a like substrate or for bonding a polyolefin, polyfluoroolefin, polyethylene terephthalate, polyacetal, nylon or plasticizer-rich soft polyvinyl chloride substrates to another substrate which comprises applying to the surface of at least one of the substrates to be bonded together an adhesion promoter composition comprising 0.001-10 wt. % of at least one organometallic compound containing a metal selected from the group consisting of typical metals, applying a cyanoacrylate-based adhesive comprising an alpha-cyanoacrylate and bringing together the thus-treated surface of the substrates to be bonded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.