Patent · US Expired

Process and apparatus for double-sided chemomechanical polishing of semiconductor wafers and semiconductor wafers obtainable thereby

US5110428A · kind A · utility

19Cited by

8References

9Claims

0Family size

Assignee

Wacker-Chemitronic Gesellschaft fur Elektronik Grundstoffe mbH · DE

Inventors

Helene Prigge · Unterschleißheim, DE
Josef Lang · Regensburg, DE

Key dates

Filing date	Sep 4, 1990
Grant date	May 5, 1992
Priority date	—
Expiry date	Sep 4, 2010

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/21
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Semiconductor wafers, in particular, silicon wafers, with differently poled front and rear sides and high geometrical quality can be fabricated by double-sided polishing if the wafer surfaces are differently polarized during the polishing process. This can be achieved in a simple fashion, in that during polishing, an electric field is set up between the upper and lower polishing plates. This can be accomplished by providing the upper polishing plate between the plate surface and the polishing cloth with a thin conductive layer insulated with respect thereto, on which a voltage can be impressed, while both polishing plates are grounded to the frame.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.