Sealing resin composition for electronic component and electronic component
US5110861A · kind A · utility
8Cited by
5References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 1989 |
| Grant date | May 5, 1992 |
| Priority date | — |
| Expiry date | Jul 28, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K9/06
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A sealing resin composition is provided with is useful in the encapsulation of an electronic component and comprises a melt-processable polyester having a weight-average molecular weight of 1000 to 3900 and is capable of forming an optically anisotropic molten phase, and at most 80 percent by weight based upon the total weight of the composition of an inorganic powder which has been surface-treated with an epoxysilane or mercaptosilane coupling agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.