Silicone pressure-sensitive adhesive composition
US5110882A · kind A · utility
16Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 1987 |
| Grant date | May 5, 1992 |
| Priority date | — |
| Expiry date | Nov 25, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A pressure-sensitive adhesive having an excellent tack and adhesive strength is obtained from a composition which contains an alkenyl group-containing silicone polymer, a tackifying silicone resin having less than one percent hydroxyl content, an organohydrogenpolysiloxne curing agent for the alkenyl group-containing silicone polymer and a platinum-containing catalyst. The composition can be cured to a silicone pressure-sensitive adhesive by heating at relatively low temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.