Composite structure resistant to thermal shocks and application thereof to multiple-layer ceramic capacitors
US5111356A · kind A · utility
4Cited by
6References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 5, 1990 |
| Grant date | May 5, 1992 |
| Priority date | — |
| Expiry date | Oct 5, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed is a multilayer type composite structure that withstands shocks and is formed by an alternation of layers made of a first material and a second material, the first material having a higher coefficient of thermal diffusivity than the second material. The distribution of the layers and their thickness are such that, in the thickness of the structure, there are zones formed by an alternation of layers of the first material and of the second material, these zones being separated from one another by a thick layer made of the second material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.