Impact resistant layer for a circuit board
US5111364A · kind A · utility
8Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 1990 |
| Grant date | May 5, 1992 |
| Priority date | — |
| Expiry date | Aug 30, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0588
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A resist film for protecting a circuit pattern is coated onto a circuit pattern formed on a circuit board, and further, a part of the resist film with which another unit comes into contact is coated with a thermosetting film. Namely, the other unit is brought into contact with a part of the circuit pattern coated with the thermosetting film, and thus, the other unit and the resist film do not come into contact with each other directly, regardless of whether or not the other unit has a high temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.