Highly conductive polymer thick film compositions
US5112687A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1991 |
| Grant date | May 12, 1992 |
| Priority date | — |
| Expiry date | Sep 30, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31797
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thermally curable conductive polymer thick film composition comprising, by weight: PA1 (a) about 3-15 parts of at least one thermoplastic vinyl acetate/vinyl chloride/dicarboxylic acid multipolymer resin; PA1 (b) a second thermoplastic resin selected from the group consisting of: PA2 (i) about 1-6 parts of at least one thermoplastic polyurethane resin; PA2 (ii) about 2-10 parts of at least one thermoplastic polyurethane resin; PA2 (iii) about 1-10 parts of a mixture of at least one thermoplastic polyurethane and at least one thermoplastic polyester resin; PA1 (c) about 0.05-1 parts of a tertiary amine; PA1 (d) an effective amount of at least one organic solvent capable of substantially dissolving (a), (b), and (c) ingredients; and PA1 (e) about 50-80 parts of silver flake.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.