Method of forming stacked tungsten gate PFET devices and structures resulting therefrom
US5112765A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 1991 |
| Grant date | May 12, 1992 |
| Priority date | — |
| Expiry date | Jul 16, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/164
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method is provided for producing a stacked semiconductor structure including: depositing a first thick passivating layer onto the base structure; forming first stud openings in the first thick passivating layer exposing at least one active region and/or one of the polysilicon lines; depositing a first layer of a conductive material to fill the first stud openings and define first contact studs, the upper part of some of the first contact studs comprising the gate electrodes of PFET devices; planarizing the structure to make the top surface of the first contact studs coplanar with the surface of the first thick passivating layer; depositing a thick insulating layer to form the gate dielectric of PFET devices and patterning it to define contact openings to expose selected first contact studs at desired locations; depositing a layer of polysilicon; patterning the polysilicon layer to define polysilicon lands containing the first contact studs at the desired locations; selectively implanting to define the source and drain regions of the PFET devices and interconnection conductors; depositing a cap layer; depositing a second thick passivating layer forming second stud op…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.