Epoxy resin composition containing long chain aliphatic diacids and/or diphenylol derivatives
US5112888A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 1990 |
| Grant date | May 12, 1992 |
| Priority date | — |
| Expiry date | Jul 12, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/934
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition suitable for encapsulating electric parts is disclosed which includes a mixed epoxy resin composed of a bisphenol epoxy resin and a novolac epoxy resin, and a curing agent selected from the group consisting of (a) aliphatic dicarboxylic acids of the formula: EQU HO--CO--R--CO--OH wherein R represents a divalent, aliphatic hydrocarbyl group containing a divalent, linear skeletal structure having at least 8 carbon atoms, (b) diphenylol derivatives of the formula: EQU HO--C.sub.6 H.sub.4 --C(CH.sub.3).sub.2 --C.sub.6 H.sub.4 --O--CH(OH)--CH.sub.2 --O--C.sub.6 H.sub.4 --C(CH.sub.3).sub.2 --C.sub.6 H.sub.4 --.sub.m OH wherein m is an integer of 0-8, and (c) mixtures thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.