Semiconductor bridge (SCB) packaging system
US5113764A · kind A · utility
20Cited by
14References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 1991 |
| Grant date | May 19, 1992 |
| Priority date | — |
| Expiry date | May 13, 2011 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF42B3/13
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention is direct to primer housings to secure a semiconductor bridge device in close proximity to an energetic charge. The primar housings are formed from an electrically conductive alloy and contain a dielectric medium disposed between components to maintain electrical isolation. The housings are characterized by high ductility to resist fracture during assembly or handling. In certain embodiments, one or both lead wires are removed to reduce the potential for lead wire breakage or separation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.