Method for forming polymer composite films using removable substrates
US5114515A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 1988 |
| Grant date | May 19, 1992 |
| Priority date | — |
| Expiry date | Jan 11, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The invention is a method for forming polymer composite films using removable substrates comprising: PA0 (a) forming a first dispersion of a first perfluorinated polymer containing sites convertible to ion exchange groups dispersed in a first dispersant having: a boiling point less than about 110.degree. C.; a density of from about 1.55 to about 2.2; and a solubility parameter of from greater than about 7.1 to about 8.2 hildebrands; PA0 (b) depositing the first dispersion onto a first removable substrate; PA0 (c) removing the first dispersant from the first dispersion, thereby forming a first film; PA0 (d) forming a second dispersion of a second perfluorinated polymer containing sites convertible to ion exchange groups and a second dispersant having: a boiling point less than about 110.degree. C.; a density of from about 1.55 to about 2.2; and a solubility parameter of from greater than about 7.1 to about 8.2 hildebrands; PA0 (e) depositing the second dispersion onto a second removable substrate; PA0 (f) removing the second dispersant from the second dispersion, thereby forming a second film; PA0 (g) bonding the first film to the second film; and PA0 (h) removing the first and the …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.