Film bonding apparatus
US5114526A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1990 |
| Grant date | May 19, 1992 |
| Priority date | — |
| Expiry date | Sep 27, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1339
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A film bonding apparatus in which a film cut to a length corresponding to that of a base plate is bonded to the surface of the plate by the application of heat and pressure with a bonding roller. The film is provided from a continuous roll and is cut to appropriate size, the trailing edge of the film being held tightly to avoid film wrinkling or air bubbles by the suction action of an edge holding member whose effective length is not less than the maximum width of the films to be bonded by the apparatus. The holding member is moveable, at a speed equal to or slightly less than the rotative circumferential velocity of the pressure roller, the speed being automatically adjusted to maintain appropriate tension on the film. Coordinated movement between the film holding member and the pressure roller is provided by a gear mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.