Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same
US5114878A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 1991 |
| Grant date | May 19, 1992 |
| Priority date | — |
| Expiry date | Mar 13, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49153
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of bonding bumps to leads of a TAB tape comprises the steps of preparing a substrate which is provided with through-holes, each having a size which will not allow the bumps to pass therethrough, at positions corresponding to bonding positions of the leads of the TAB tape where the bumps are to be bonded; provisionally arranging the bumps at positions of the through-holes at one side of the substrate by reducing a pressure in another side of the substrate opposite to said one side thereof to such the bumps in said through-holes; disposing the substrate on which the bumps are provisionally arranged and said TAB tape in such a positional relationship that said bumps face to the bonding positions of the leads of said TAB tape; and bonding the provisionally arranged bumps to the leads at the bonding positions and an apparatus for arranging bumps in a positional relationship corresponding to bonding positions of leads of a TAB tape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.