Single substrate microwave radar transceiver including flip-chip integrated circuits
US5115245A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Sep 4, 1990 |
| Grant date | May 19, 1992 |
| Priority date | — |
| Expiry date | Sep 4, 2010 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01S2013/93275
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A microwave radar transceiver assembly (30) includes a monolithic microwave integrated circuit (MMIC) chip (58) having a coplanar waveguide transmssion lines (100, 102, 104) formed on the same surface (58a) as the electronic elements thereof. Coplanar waveguide transmission lines (68, 70, 72) are also formed on a surface (62a) of a substrate (62). The transceiver chip (58), in addition to other chips (56, 60), are mounted on the substrate (62) in a flip-chip arrangement, with the respective surfaces (58a, 62a) on which the transmission lines (100, 102, 104; 68, 70, 72) are formed facing each other. Electrically conductive bumps (106, 108, 110) are formed on portions of the transmission lines (100, 102, 104) of the chips (56, 58, 60) which are to be interconneced with the transmission lines (68, 70, 72) of the substrate (62), and solder (114) is formed on the portions of the transmission line (68, 70, 72) of the substrate (62) which are to be interconnected with the transmission lines (100, 102, 104) of the chips (56, 68, 60). The bumps (106, 108, 110) provide spacing between the mating surfaces (58a, 62a) of the substrate (62) and chips (56, 68, 60), and isolation between electroni…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.