Hermetically sealed chip carrier with ultra violet transparent cover
US5115299A · kind A · utility
41Cited by
7References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 13, 1989 |
| Grant date | May 19, 1992 |
| Priority date | — |
| Expiry date | Jul 13, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A hermetically sealed chip carrier including a lead frame for use with an EEPROM chip, the carrier including a pre-molded plastic beam and an ultra violet transparent cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.