Method for low pressure bonding of PCD bodies
US5116568A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 1991 |
| Grant date | May 26, 1992 |
| Priority date | — |
| Expiry date | May 31, 2011 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23B2226/315
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An improved temperature stable synthetic polycrystalline diamond (PCD) product includes at least one temperature stable PCD integrally and chemically bonded to a matrix carrier support through a carbide forming layer which is of a thickness of at least about 1 micron, the layer on at least one surface of the PCD is in turn is bonded to the matrix carrier. A wide variety of shapes, sizes and configurations of such products is achieved through relatively low temperature and relatively low pressure processing. Various products of various geometries are described as well as the details of the processing to achieve chemical bonding of the PCD elements in a variety of support matrix carrier materials to form a unitary structure having a temperature stability up to about 1,200 degrees C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.