Resin composition
US5116885A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 1990 |
| Grant date | May 26, 1992 |
| Priority date | — |
| Expiry date | Sep 21, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/013
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition having inorganic filler particles with an average particle size of from 0.05 to 150 .mu.m incorporated in an amount of from 20 to 85% by volume based on the entire resin composition, wherein: PA0 (a) said particles comprise at least two groups of particles differing in the average particle size, PA0 (b) particles constituting a group of particles with the smallest average particle size, are spherical particles with an average particle size smaller than 5 .mu.m, PA0 (c) a group or groups of particles with an average particle size larger than the particles of (b), are constituted by spherical particles, pulverized particles or a mixture thereof, PA0 (d) as between two groups of particles with their average particle sizes being close to each other, the ratio of the minimum particle size within a range defined by the standard deviation of the particle size distribution of the group of particles with a large average particle size, to the maximum particle size within a range defined by the standard deviation of the particle size distribution of the group of particles with a small average particle size, is at least 2, and PA0 (e) the proportion of the volume of the gro…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.