Heat distortion resistant, thermoplastic molding material containing a copolymer, preparation of the molding material and its use

US5116907A · kind A · utility

Assignee

• BASF SE

Inventors

• Ehrenfried Baumgartner · Bad Dürkheim, DE
• Adolf Echte · Ludwigshafen, DE
• Juergen Mertes · Ingelheim am Rhein, DE

Key dates

• Filing date: Sep 28, 1990
• Grant date: May 26, 1992
• Expiry date: Sep 28, 2010

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08F220/54
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A molding material is described which contains, in each based on the sum of A, B and C, PA0 A. from 5 to 95, in particular from 20 to 80, % by weight of a copolymer comprising PA0 a) from 1 to 95% by weight of styrene, PA0 b) not more than 40% by weight of acrylonitrile and PA0 c) from 5 to 98% by weight of an amide of methacrylic acid of the formula I ##STR1## where R is primary, secondary or tertiary alkyl, cycloalkyl, aryl or aralkyl of 1 or 6 or 7, respectively, to 12 carbon atoms, with the proviso that, when alkyl is methyl or isopropyl, the copolymer has a styrene content of less than 75% by weight, PA0 B. from 5 to 60, in particular from 10 to 40, % by weight of a graft polymer B, prepared by emulsion polymerization of a mixture of styrene and acrylonitrile in the weight ratio from 60:40 to 90:10 in the presence of, based on the amount of expected copolymer, from 40 to 80, in particular from 50 to 70, % by weight of a conventional particulate, partially crosslinked diene rubber or acrylate rubber, and PA0 C. Not more than 90, in particular from 10 to 40, % by weight of a further thermoplastic resin C.