Circuit board fabrication
US5117069A · kind A · utility
77Cited by
9References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 28, 1990 |
| Grant date | May 26, 1992 |
| Priority date | — |
| Expiry date | Sep 28, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/901
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high density multi-level printed wiring board having inter-level electrical connections made by via interconnect holes which are drilled or punched through only those layers of the wiring board that separate the two layers containing the conductors which are to be connected and said holes being filled with a low-resistance silver-filled conductive epoxy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.