Through hole mounting of integrated circuit adapter leads
US5118298A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 4, 1991 |
| Grant date | Jun 2, 1992 |
| Priority date | — |
| Expiry date | Apr 4, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An adapter that is to be conneced to contacts on a mother circuit surface. The adapter has a circuit bearing element, such as a printed circuit board, with connection sites that are connected to metalized holes opening onto its top side. Leads are anchored (e.g., by soldering) in the holes and bent down around the edge of the top side of the circuit bearing element to below it, and may be connected to the contacts on the mother circuit surface. The leads may be provided to the circuit bearing element, using lead frame elements provided in a lead frame, by bending the lead frame elements, soldering them in holes in the circuit bearing element, bending the soldered leads down around the edge of the top surface of the circuit bearing element and below it, and removing a side frame portion from the bent lead frame. Bending and cutting of the leads may be performed in a single operation with a single tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.