Printed circuit board having bumps and method of forming bumps
US5118386A · kind A · utility
41Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1989 |
| Grant date | Jun 2, 1992 |
| Priority date | — |
| Expiry date | Dec 18, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/054
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board having a plurality of bumps that serve for connection terminals, the bumps being formed by covering the printed circuit except portions where the bumps are to be formed, applying an electroplating onto the uncovered bump-forming portions on the printed circuit maintaining a thickness nearly equal to that of the covering, applying thereon a non-electrolytic plating and electroplating on the whole surface from the surfaces of the bump-forming portions to the surfaces of the covered portions, and removing the platings by etching from the surface except the bump portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.