Method of ultrasonic inspection of materials through opaque barriers
US5118464A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 1991 |
| Grant date | Jun 2, 1992 |
| Priority date | — |
| Expiry date | Mar 15, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E30/30
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An improved apparatus and method for ultrasonic inspection of materials through barriers such as gaps in manufactured parts is disclosed. The improvement herein is directed to enabling such ultrasonic testing to bridge ambient gaps such as intentionally formed gaps in composite structures having a first structure for originally receiving and transmitting sound separated by the gap from another structure to be inspected. Preferably, the gap is flooded with a gas having a predictable and optimum speed of sound relative to the material of the first and second structures. Sound is propagated to the first structure in a wave packet that is transmitted through the couplant fluid. The sound is generated in a wave packet having a spatial width at least twice the dimension of the gap to be bridged. The wave packet has a contained frequency having a wavelength (relative to the speed of sound of the gas flooding the gap) to create a constructively interfering standing wave node within the gap. The sound propagated to the gas-filled gap has a wavelength which is a half-integer with respect to the gap dimension. Sound passes through the first structure, creates a standing wave node in the gas-f…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.