Method of producing microbump circuits for flip chip mounting
US5118584A · kind A · utility
21Cited by
16References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1990 |
| Grant date | Jun 2, 1992 |
| Priority date | — |
| Expiry date | Jun 1, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/143
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a microbump flip-chip mounting method, microcircuit features such as conductors and microbumps are formed by a lift off process. A first refractory metal is employed to promote adhesion between a layer of aluminum deposited by physical vapor deposition and a second refractory metal is employed to promote adhesion between the aluminum and an overlying layer of gold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.