Multi-layer structure and method of constructing the same for providing TFEL edge emitter modules
US5118987A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 1989 |
| Grant date | Jun 2, 1992 |
| Priority date | — |
| Expiry date | Nov 13, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B33/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A TFEl structure has a multi-layer construction which includes a bottom substrate layer, a lower electrode layer, a middle EL stack, and an upper electrode layer. Forward portions of the EL stack and the lower and upper electrode layers have formed therethrough a series of longitudinal channels and a transverse street connecting the channels and extending along a forward edge of the bottom substrate layer so as to define a plurality of pixels having light-emitting front edges setback from the forward edge of the bottom substrate layer by the width of the street. Rearward portions of the lower and upper electrode layers respectively underlie and overlie a rearward portion of the EL stack but not each other so as to electrically isolate the rearward portions of the lower and upper electrode layers from one another. Also, a bus bar layer overlies the rearward portion of the EL stack and crosses the rearward portion of the upper electrode layer. An insulation layer is interposed between the rearward portions of the bus bar layer and upper electrode layer. Selected portions of the bus bar layer and upper electrode layer are electrically connected together through the insulation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.