Heat-resistant insulating substrate, thermal printing head, and thermographic apparatus
US5119112A · kind A · utility
1Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 1990 |
| Grant date | Jun 2, 1992 |
| Priority date | — |
| Expiry date | May 4, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A layer of an amorphous substance containing at least one member from among hydrogen and halogen elements and using as main components thereof silicon and at least one member selected from among nitrogen, carbon and oxygen is formed as a resin-protecting layer or an abrasion-resistant layer in a thermal printing head or as a resin-protecting layer in a heat-resistant insulating substrate. The hardness of the substrate itself is greatly improved by this layer of the amorphous substance. As the result, the substrate as a whole or the thermal printing head as a whole acquires high rigidity and improved resistance to crack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.