Microelectronic device package employing capacitively coupled connections
US5119172A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 1991 |
| Grant date | Jun 2, 1992 |
| Priority date | — |
| Expiry date | Mar 4, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic device including a passivation layer disposed on the top surface has disposed on a portion of its surface a bonding agent. The resulting structure is inverted and sealed to a package base, forming a hermetically sealed cavity. This protects the microelectronic device from the environment. External electrical connection to other electronic apparatus is effected by means of conductors disposed on the package base surface. Alternating current (AC) capacitive coupling contacts allow electrical coupling to the microelectronic device and prevent violation of the integrity of the passivation layer. This method realizes compact microelectronics device packages which can be mass produced from entire microelectronic device substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.