Pulse echo and through transmission ultra-sound
US5119678A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 1989 |
| Grant date | Jun 9, 1992 |
| Priority date | — |
| Expiry date | Dec 26, 2009 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/269
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for locating and identifying defects in a variable geometry workpiece using first and second transceivers positioned of a preselected distance apart adjacent opposite surfaces of the workpiece and aligned to direct ultrasonic signals toward each other through the workpiece. An ultrasound signal is transmitted from each transceiver toward the workpiece. Signal reflections from each adjacent workpiece surface are detected and used to compute workpiece thickness. Signals from one transceiver are detected at the other transceiver and their intensity determined. The signal intensity is normalized in proportion to the obtained workpiece thickness to establish a signal intensity independent of workpiece thickness. In one form, at least three signal processing paths, each having a different preselected gain, provide three signals of different amplified intensities for each measurement point. The one of the signals having the greatest amplitude not exceeding an established maximum processable signal intensity is selected and the actual intensity of the signal passing through the workpiece is computed by correlating the amplitude of the selected one of the three signals with the gai…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.