Tape bonding apparatus
US5120391A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 16, 1990 |
| Grant date | Jun 9, 1992 |
| Priority date | — |
| Expiry date | Apr 16, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A tape bonding apparatus including a bonding guide for guiding a tab tape, which has leads, to a bonding position, a clamper located under the bonding guide for pressing the tab tape against the bonding guide, a pellet stage provided beneath the clamper, and a vertically movable bonding tool located above the bonding guide, in which a hole formed in the clamper is larger than opening of the tab tape, and the holes formed in the bonding guide and clamper are about the same in shape as the opening of the tape so as to prevent the leads set on the tab tape from coming into contact with the clamper, thus avoiding any damage to the leads. Also, the bonding guide is flat near the bonding position, and the pellet stage is smaller than the window of the clamper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.