Process for producing metal/polyimide composite article
US5120573A · kind A · utility
8Cited by
6References
9Claims
0Family size
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Inventors
Key dates
| Filing date | Sep 27, 1989 |
| Grant date | Jun 9, 1992 |
| Priority date | — |
| Expiry date | Sep 27, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a process for producing a metal/polyimide composite article such as high-density wiring boards. This metal/polyimide composite article is produced by a method which comprises coating a polyamic acid alkyl ester represented by the following formula on a metallic film and curing it: ##STR1## wherein R.sub.1 and R.sub.2 which may be identical or different each represents an organic group of 1 or more carbon atoms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.