Dielectric compositions
US5120579A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 1991 |
| Grant date | Jun 9, 1992 |
| Priority date | — |
| Expiry date | Aug 23, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of bonding a dielectric material to a substrate comprising the steps of: PA1 I. providing a substrate; PA1 II. providing a dielectric composition comprising: PA2 (a) about 30% to about 100% by weight of a glass composition selected from the group consisting of: PA3 (a-1) a mixture of two glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C. and a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C.; or PA3 (a-2) a mixture of three glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C., a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C., and a third glass composition having a glass transition temperature in the range of about 650.degree. C. to about 720.degree. C.; PA1 III. applying to at least one surface of the substrate the dielectric; and PA1 IV. heating the substrate in a nonoxidizing atmosphere to a temperature sufficient to pe…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.