Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits
US5120665A · kind A · utility
119Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 1991 |
| Grant date | Jun 9, 1992 |
| Priority date | — |
| Expiry date | Mar 19, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1163
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B). Also, a method of using for the composition connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.