Hot melt adhesives having improved pot lives and processes for their preparation
US5120789A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 1991 |
| Grant date | Jun 9, 1992 |
| Priority date | — |
| Expiry date | Jan 15, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/304
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Hot melt adhesive compositions having longer pot lives and comprising adhesive thermoplastic compositions having high cohesion and low flowability based on copolymers A) composed of ethylenically unsaturated monomers containing chelating metal compounds B) and, if desired, other conventional additives C), these hot melt adhesive compositions additionally containing an alkylphenolic resin or an arylphenolic resin in amounts of up to 20% by weight, relative to copolymer A), as crosslinking regulator in order to extend the pot life and to improve their processibility like a thermoplastic, and processes for preparing hot melt adhesive compositions by mixing the starting components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.